We are entering the era of intelligent connectivity – where speed, convenience, and intelligence converge; inspiring innovations that keep us connected to everything and everyone. Join us from the 26th to the 28th of June 2019 in Shanghai, to discover how intelligent connectivity will shape the future of our digital experiences, our industry and our world.
We’re coming to prove that it’s possible to manufacture phones, modules, or IoT devices that can connect seamlessly around the globe. We’ll be joining STMicroelectronics to exhibit our bootstrap technology; installing eSIMs onto ST hardware using our GSMA-accredited remote SIM provisioning platform. Intelligent connectivity is here, and we’re making it global.